Ut vestibulum ut summus finem transmutatio, in celeri progressionem in agro mundis industria et semiconductor et photovoltaic industria progressionem, cum princeps efficientiam et excelsum praecisionem processus facultatem adamas et matrix tenens vim non est facile mane carbide Mors Principium non est facile diluculo carbide vitae non est fortis facile ad Diamond Mors Principium Est Mors Principium Est Mors Principium Est Mors Principium Est Mors Principium Est et Mors Principium Est Mors Principium Est Mors Principium Est Mors Principium Est et Mors Principium Est Mors Principium Est Mors Principium Est et Male. Ut solvere his problems, in industria plerumque adoptat adamas pulveris superficiem coating cum metallum materiae, ut amplio eius superficiem habet, augendae diuturnitatem, ut amplio altiore quale ad instrumentum, ita ut amplio qualitas ad augendae, ita ut amplio altiore quale ad instrumentum, ita ut amplio altiore qualitas ad instrumentum, ita ut amplio qualitatem ad augendae, ut ad amplio altiore qualitas ad instrumentum, ita ut amplio altiore qualitas ad instrumentum, ita ut amplio altiore quale ad instrumentum.
Diamond Pulvis superficiem coating modum est magis, comprehendo eget plating, electroplating, magnetron pullhting plating, vacuo, et adeo, uniformis, ut in matura, comprehendo technology, quod est in industria, ut cum technology est in industria.
I. Chemical plating
Diamond Pulvis chemical coating est ad induendum tractata Diamond Pulvis in chemical coating solutio, et deposit metallum iones in coating solutio per actum reducing agente in chemical coating solutio, formatam densa metallum coating. In praesens, maxime late adamantino chemical plating est eget nickel plating-phosphoro (ni-p) binarii mley est plerumque dicitur eget nickel plating.
I Compositionem eget Nickel plating Solutio
Compositionem chemical plating solution habet decretorium influentiam in lenis progressus, stabilitatem et coating qualis est eget reactionem. Plerumque continet pelagus sal, reducendo agente, complexer, quiddam, stabilitor, accelerator, surfactor et alia components. Quantum cuiusque component postulo ut diligenter accommodetur ad consequi optimum coating effectus.
I, pelagus sal: plerumque Nickel sulfate, Nickel chloride, Nickel amino Sulfonic acidum, Nickel carbonate, etc, eius principalis munus est providere nickel fonte.
II. ADMUTUCTUGUALIS agente: quod maxime praebet atomicus hydrogenii, reduces ni2 + in plating solutio in ni et deponit eam super superficiem adamantino particulas, quae est maxime pars in plating solution. In industria, sodium secundarium phosphate cum fortis reductionem facultatem, humilis sumptus et bonum plating stabilitatem est maxime usus est reducing agente. Reductio ratio potest consequi eget plating humilis temperatus et caliditas.
3, complex agent: the coating solution can precipitate precipitation, enhance the stability of the coating solution, extend the service life of the plating solution, improve the deposition speed of nickel, improve the quality of the coating layer, generally use succinin acid, citric acid, lactic acid and other organic acids and their salts.
IV. Alii components: et stabilitor potest inhibere compositione de plating solution, sed quod erit afficit eventum eget plating reactionem, opus moderari usum; Buffer potest producendum h + per chemical nickel plating reactionem ut continua stabilitatem PH; Et surfactant potest reducere in coating poros.
II De eget Nickel-plating processus
Et eget animum sodium hypophosphate system requirit quod matricem oportet habere quaedam catalytic actione et adamas superficiem se non habet catalytic actionem centrum, sic indiget preterito ante chemical plateae adamantino pulveris. Et traditional preteratment modum eget plating est oleum remotionem, coarsoening, sensitization et activation.
(I) oleum remotionem, coarsoening: oleum remotionem est maxime ad removendum oleum, maculas et alia organica pollutants super superficiem adamantino pulveris, ut proxima fit et bonum perficientur de subsequent coating. The coarsening can form some small pits and cracks on the surface of diamond, increase the surface roughness of diamond, which is not only conducive to the adsorption of metal ions in this place, facilitate the subsequent chemical plating and electroplating, but also form steps on the surface of diamond, providing favorable conditions for the growth of chemical plating or electroplating metal deposition layer.
Plerumque, et oleum remotionem gradum solet accipit Naoh et alia alkaline solutio sicut oleum remotionem solution, et ad Coarsening gradum, in acidum acidum et alii acidum solutio adhibetur sicut crudi eget solutio ad Diamonds superficiem. In addition, these two links should be used with ultrasonic cleaning machine, which is conducive to improving the efficiency of diamond powder oil removal and coarsening, save the time in the oil removal and coarsening process, and ensure the effect of oil removal and coarse talk,
(II) sensitization et activation: et sensitization et activation processus est maxime discrimine gradum in toto eget plating processus, quae directe ad utrum eget plating potest ferri. Sensitization est Adsorb facile oxidized substantiae superficies adamantino pulveris quod non autocatalytic habebat. Et activation est adsorb oxidatio hypophosphoric acidum et catalytically activae metallum iones (ut metallum Palladium) in reductionem nickel particulas, ut accelerare depositionem rate de coating super superficiem adamantino pulveris.
Generally speaking, the sensitization and activation treatment time is too short, the diamond surface metal palladium point formation is less, the adsorption of the coating is insufficient, the coating layer is easy to fall off or difficult to form a complete coating, and the treatment time is too long, will cause the palladium point point waste, therefore, the best time for sensitization and activation treatment is 20~30min.
(III) eget Nickel plating: quod eget Nickel plating processus non solum affectus compositionem de coating solution, sed etiam affectus in coating solutio temperatus et PH valorem. Traditional high temperature chemical nickel plating, the general temperature will be in 80~85℃, more than 85℃ easy to cause the decomposition of the plating solution, and at the lower than 85℃ temperature, the faster the reaction rate. On PH value, as the pH increase coating deposition rate will rise, but the pH will also cause nickel salt sediment formation inhibit chemical reaction rate, so in the process of chemical nickel plating by optimizing the chemical plating solution composition and ratio, chemical plating process conditions, control the chemical coating deposition rate, coating density, coating corrosion resistance, coating density method, coating diamond powder in occursum de industriae progressionem demanda.
In addition, una coating non consequi ad specimen coating crassitudine, et non potest esse bullae, pinholes et aliis defectibus, ita multiplex coating potest capta ad emendare adamantino pulveris.
II. Nickelling Carmina
Ob coram phosphoro in coating layer post Diamond Pectus eget Nickel plating, ducit ad pauperes electrica conductivity, quod afficit harenae loading processus adamantum in matricem superficiem), ita et layer sine phosphoro potest esse in via de Nickel layer sine phosphoro potest esse in via de Nickel plating. The specific operation is to put the diamond powder into the coating solution containing nickel ions, diamond particles contact with the power negative electrode into the cathode, nickel metal block immersed in the plating solution and connected with the power positive electrode to become the anode, through the electrolytic action, the free nickel ions in the coating solution are reduced to atoms on the diamond surface, and the atoms grow into the coating.
I compositionem de plating solution
Sicut chemical plating solution, in electroplating solutio maxime providet necessaria metallum ions ad electroplating processus, et controls in nickel depositione processus adipisci requiritur metallum coating. Et principalis components includit pelagus sal, Anode activae agens, quiddam agens, additives et sic est.
(1) Main salt: mainly using nickel sulfate, nickel amino sulfonate, etc. Generally, the higher the main salt concentration, the faster the diffusion in the plating solution, the higher the current efficiency, the metal deposition rate, but the coating grains will become coarse, and the decrease of the main salt concentration, the worse conductivity of the coating, and difficult to control.
(2) Anode active agent: because the anode is easy to passivation, easy to poor conductivity, affecting the uniformity of current distribution, so it is necessary to add nickel chloride, sodium chloride and other agents as anodic activator to promote anode activation, improve the current density of the anode passivation.
(III) quiddam agente: sicut eget plating solution, in quiddam agens potest ponere relativum stabilitatem plating solution et cathode PH, ita ut possit fluctuant in licita range ad electroplating processus. Commune quiddam agens habet boric acidum, acetic acidum, sodium bicarbonate et sic est.
(IV) Alia additives: secundum ad necessitates de coating, additivas ius moles clara agente, adtritio agente, madefecissem agente et miscellaneous agente et alia additives ad amplio qualitas et alias.
II Diamond Pectus Electroplated Nickel
I. Pretreatment ante Plasmodium: Diamond est saepe non PROLIXUS et indiget ad patella cum iacuit metallum per alias coating processus. Chemical plating modum saepe solebat pre-plating layer metallum et spissior, ita qualis est eget coating et afficit qualis est plating iacuit ad quodammodo. Generaliter loquendo, de phosphoro in coating post chemical plating habet magnum labefactum in qualis est de coating et princeps phosphoro coating habet relative melius corrosio resistentia in acidic environment est relative melius corrosio resistentia in acidic environment est relative melius corrosio resistentia in acidic environment, magnetricis superficiem et magneticam proprieticam; Medium phosphoro coating habet et corrosio resistentia et gerunt resistentia; Et humilis phosphoro coating habet relative melius conductivity.
In addition, the smaller the particle size of the diamond powder, the larger the specific surface area, when coating, easy to float in the plating solution, will produce leakage, plating, coating loose layer phenomenon, before plating, need to control the P content and coating quality, to control the conductivity and density of diamond powder to improve the powder easy to float.
2, nickel plating: at present, diamond powder plating often adopts the rolling coating method, that is, the right amount of electroplating solution is added in the bottling, a certain amount of artificial diamond powder into the electroplating solution, through the rotation of the bottle, drive the diamond powder in the bottling to roll. Simul positivum electrode connexa nickel schoctrina et negativa electrode connectitur artificialis adamas pulverem. Sub actione electrica agro, in Nickel ions in plating solutio formare metallum nickel in superficies artificialis adamantino pulveris. Sed hoc modum habet difficultates humilis coating efficientiam et inaequaliter coating, ita gyrari electrode modum venit in esse.
Rotating Electrode modum est gyrari in cathode in adamantino pulveris plating. Hoc modo potest crescere contactus area inter electrode et adasta particulas, auget uniformis conductivity inter particulas, amplio inaequaliter phaenomenon coating et amplio productio efficientia adamas nickel plating.
Brevis
Ut pelagus rudis materia de Diamond Tools, superficiem modificatio adamantino micropowder est momenti significat ad augendae matricem imperium vi et amplio servitium vitae instrumenta. Ut ad amplio arenam loading rate of Diamond Pectus Tools, et iacuit de Nickel et phosphoro potest plerumque patella in superficiem adamantino micropowder habere quaedam conductivity, et tintinatam plating per nickel plating et ad plating. Tamen, ut notandum est quod adamas superficiem se non habet a catalytic activae centrum, ut indiget ut preterruit ante chemical plating.
Reference Documentation:
Liu Han. Studium super superficiem coating technology et qualis est artificialis adamas Micro pulveris [d]. Zhongyuan Institute of Technology.
Yang Biao, Yang Iun et Yuan Guangsheng. Studium in preteratment processus adamas superficiem coating [J]. Spatium spatium standardization.
Li Jinghua. Research super superficiem modificatio et applicationem artificialis adamas Micro Pulvis usus est filum vidit [d]. Zhongyuan Institute of Technology.
Fang Lili, Zheng Lian, Wu Yanfei, et al. Chemical Nickel plating processus artificialis adamas superficies [J]. Journal IOL.
Hic articulus est reprinted in Superhard Material Network
Post tempus: Mar-13-2025
